Posts By Editor
TEOCO Launches Helix 9.1 with Advanced Self-Learning Analytics for Automated Service Assurance
May 10, 2016 | EditorTEOCO, the leading provider of assurance, analytics and optimization solutions to communications service providers (CSPs), today announced the launch of Helix 9.1, the latest version of its Service Assurance solution. The latest version of Helix includes new self-learning analytics and … Read More
Corning Earns Individual Achievement Award and Technological Innovation Recognition
May 9, 2016 | EditorCorning Incorporated (NYSE:GLW) today announced it was twice recognised at the recent Society of Cable Telecommunications Engineers (SCTE) gala dinner in London, U.K.
Dr. Merrion Edwards, director, Market and Technology Development, Corning Optical Communications, won the “2016 David Hall Award … Read More
Telcos Failing to use Best Practice to Capture SMB SaaS Opportunities
May 9, 2016 | EditorBCSG, the leading cloud services marketplace provider, today announced fresh insight that reveals the challenges telecom operators are facing in driving uptake of cloud services amongst SMB customers. Previous research conducted on behalf of BCSG suggests this market may potentially … Read More
Quortus White Paper Shines Light on Transformative Potential of MEC
May 9, 2016 | EditorQuortus today published a new white paper in conjunction with Rethink Technology Research, outlining the commercial potential and technical aspects of mobile edge computing (MEC). The paper analyzes opportunities the technology creates for MNOs, MVNOs and MVNEs, and outlines a … Read More
UltraSoC selected as a Gartner “Cool Vendor”
May 9, 2016 | EditorUltraSoC, the leading provider of semiconductor IP for on-chip analytics, performance optimization and hardware-based security, today announced that it has been recognized by Gartner Inc as a “Cool Vendor” in the Embedded Software and Systems market.
UltraSoC’s silicon IP and … Read More
HUBER+SUHNER to Showcase New SUCOFLEX 500V, SUCOFLEX 126, Microbend L and RF-over-Fiber Products at IMS 2016
May 5, 2016 | EditorGlobal connectivity leader HUBER+SUHNER continues to establish its expertise at the International Microwave Symposium in San Francisco, 22-27 May 2016, exhibiting a range of new products including SUCOFLEX 500V VNA test assemblies, Microbend L, SUCOFLEX 126 and its RF/GPS/LAN-over-Fiber Series, … Read More