Image Image Image Image Image Image Image Image Image Image

TelecomsTalk | December 1, 2025

Scroll to top

Top

Posts By Editor

TEOCO Launches Helix 9.1 with Advanced Self-Learning Analytics for Automated Service Assurance

May 10, 2016 |

TEOCO, the leading provider of assurance, analytics and optimization solutions to communications service providers (CSPs), today announced the launch of Helix 9.1, the latest version of its Service Assurance solution. The latest version of Helix includes new self-learning analytics and … Read More

Corning Earns Individual Achievement Award and Technological Innovation Recognition

May 9, 2016 |

Corning Incorporated (NYSE:GLW) today announced it was twice recognised at the recent Society of Cable Telecommunications Engineers (SCTE) gala dinner in London, U.K.

Dr. Merrion Edwards, director, Market and Technology Development, Corning Optical Communications, won the “2016 David Hall Award … Read More

Telcos Failing to use Best Practice to Capture SMB SaaS Opportunities

May 9, 2016 |

BCSG, the leading cloud services marketplace provider, today announced fresh insight that reveals the challenges telecom operators are facing in driving uptake of cloud services amongst SMB customers. Previous research conducted on behalf of BCSG suggests this market may potentially … Read More

Quortus White Paper Shines Light on Transformative Potential of MEC

May 9, 2016 |

Quortus today published a new white paper in conjunction with Rethink Technology Research, outlining the commercial potential and technical aspects of mobile edge computing (MEC). The paper analyzes opportunities the technology creates for MNOs, MVNOs and MVNEs, and outlines a … Read More

UltraSoC selected as a Gartner “Cool Vendor”

May 9, 2016 |

UltraSoC, the leading provider of semiconductor IP for on-chip analytics, performance optimization and hardware-based security, today announced that it has been recognized by Gartner Inc as a “Cool Vendor” in the Embedded Software and Systems market.

UltraSoC’s silicon IP and … Read More

HUBER+SUHNER to Showcase New SUCOFLEX 500V, SUCOFLEX 126, Microbend L and RF-over-Fiber Products at IMS 2016

May 5, 2016 |

Global connectivity leader HUBER+SUHNER continues to establish its expertise at the International Microwave Symposium in San Francisco, 22-27 May 2016, exhibiting a range of new products including SUCOFLEX 500V VNA test assemblies, Microbend L, SUCOFLEX 126 and its RF/GPS/LAN-over-Fiber Series, … Read More

UA-102569295-1